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Overseas experimental equipment March AP1000 plasma cleaning machine
- Product description: Product Description: Large processing space, increased processing capacity, using PLC+touch screen control system, precise control of equipment operation; Customizable equipment cavity capacity and nu
Product introduction
Vacuum plasma cleaning machines are suitable for the printed circuit board industry, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multi-layer board surface cleaning and de drilling, soft board and soft hard combination board surface cleaning and de drilling, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF processes, used for cleaning before wiring and welding; Plasma surface roughening, etching, and activation of silicone, plastic, and polymer fields.Vacuum plasma cleaning machine system manufacturers use plasma formed by gas ionization to treat the surface of product workpieces, whether for cleaning or surface activation. In order to better achieve high-quality treatment results, different processing gases need to be selected for different products. Common processing gases for plasma cleaning machines include oxygen (O2), argon (Argon, Ar), and nitrogen (Nitrogen, N2), Compressed Air (CDA), carbon dioxide (CO2), hydrogen (H2), Carbon tetrafluoride (CF4), etc.
1. Oxygen
Oxygen is a common plasma cleaning active gas, which belongs to the physics+chemical treatment method. Ions generated by ionization can physically bombard the surface, producing an unsmooth and rough surface. In addition, highly reactive oxygen ions can react with the molecular structure chain of the broken bond, and convert it into a hydrophilic surface with active groups to complete the purpose of surface activity; The organic pollutants that have been broken can react chemically with reactive oxygen ions, producing molecules such as CO, CO2, and H2O to detach from the surface and complete surface cleaning. Oxygen key is used for the surface activity of polymer and the removal of pollutants, but it cannot be used for easily oxidized metal surfaces. Under vacuum plasma, the oxygen plasma is Baby blue, and some of it is milky white when charging and discharging; In the discharge environment, the light is bright, and when viewed with the naked eye, it is very likely that the discharge inside the actual chamber cannot be seen.
2. Hydrogen gas
Hydrogen, similar to oxygen, is a highly active gas that can activate and clean the surface layer. The difference between hydrogen and oxygen depends crucially on the different functional groups generated after the reaction. In addition, hydrogen also has reducibility and can be used to remove the micro oxide layer on the metal surface, making it less prone to damaging the sensitive organic layer on the surface. Therefore, it is widely used in microelectronics technology, semiconductor materials, and PCB circuit board processing and manufacturing industries. Because hydrogen is a dangerous gas that can easily fuse with oxygen without ionization and cause explosions, it is not allowed to mix these two gases in plasma cleaning machines. In the vacuum plasma state, hydrogen plasma is bright red, similar to argon plasma, but slightly darker in color than argon plasma under the same discharge environment.
3. Nitrogen
The plasma ionized by nitrogen produces bonding reaction with some molecules, so it is also an active gas. However, compared with oxygen and hydrogen, its particles are heavier. In the application of general plasma cleaning machines, this kind of gas is generally defined as a gas between the active gas oxygen, hydrogen and Noble gas argon. When cleaning and activating, it is necessary to achieve a certain effect of bombardment and etching, while avoiding air oxidation of a portion of the metal surface. A plasma formed by mixing nitrogen and other gases, typically used to treat special materials. In the vacuum chamber, nitrogen plasma will be brighter than argon and hydrogen plasma under the same discharge condition.
Plasma surface treatment
Oxygen plasma treatment is currently a commonly used dry etching method. Oxygen (sometimes mixed with argon) is used to treat the surfaces of aluminum, stainless steel, glass, plastics, and ceramics.
Plasma activation
Slightly changing the activated surface can result in better printing or bonding. Etching machines can allow plasma to erode printed circuit boards, improving their adhesive properties, such as adhesion and finishes.
Plasma surface modification
Modification of plasma surface treatment equipment refers to the cleaning of products to improve their printing or adhesive adhesion capabilities. The purpose of plasma cleaning is to remove surface organic pollutants. Plasma treat the surface of your product to receive adhesive or printing ink. Commonly used for surface modification of polytetrafluoroethylene or plastic by plasma, it actually changes the surface of the material, leaving free radicals and adhering to the adhesive or ink. Contact person: Ms. Zou 14778271944