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PLASMAXYour position: Home > PLASMAX
Plasma cleaning machine equipment brand-new products leave the factory
- Product description: Large processing space, improved processing capacity, PLC + touch screen control system, accurate control of equipment operation; The capacity and number of layers of equipment cavity can be customize
Product introduction
Vacuum plasma cleaning machine is suitable for printed circuit board industry, semiconductor ic field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high frequency board surface activation, multilayer board surface cleaning and decontamination, soft board, soft hard combination board surface cleaning and decontamination, and activation before soft board reinforcement. Semiconductor ic field: cob, COG, COF and ACF processes, which are used for cleaning before wiring and welding; In the field of silica gel, plastic and polymer, the plasma surface of silica gel, plastic and polymer is roughened, etched and activated.The manufacturer of vacuum plasma cleaning machine system uses the plasma formed by gas ionization to carry out surface treatment on product workpieces, whether cleaning or surface activation. In order to better achieve high-quality treatment effect, different processing process gases are selected for different products. The common processing process gases of plasma cleaning machine include oxygen (O2), argon (argon, AR), Nitrogen (N2), compressed air (CDA), carbon dioxide (CO2), hydrogen (H2), carbon tetrafluoride (CF4), etc.
1. Oxygen
Oxygen is a common plasma cleaning active gas, which belongs to the physical + chemical treatment method. The ions caused by ionization after ionization can physically bombard the surface to produce a non smooth and rough surface. In addition, highly reactive oxygen species can react with the broken molecular structure chain and transform into a hydrophilic surface layer with active groups to complete the purpose of surface activity; The broken organic pollutants can react with reactive oxygen ions to produce CO, CO2, H2O and other molecules to separate from the surface and complete the surface cleaning. Oxygen is mainly used for the surface activity of polymer and the removal of pollutants, but it can not be used for the surface of metal that is easy to oxidize. Under vacuum plasma, oxygen plasma is light blue, and part of it is milky white during charge and discharge; The light in the discharge environment is bright, and the discharge in the real lumen is likely to be invisible when viewed with the naked eye.
2. Hydrogen
Similar to oxygen, hydrogen is a highly active gas, which can activate and clean the surface. The difference between hydrogen and oxygen mainly depends on the different functional groups produced after the reaction. In addition, hydrogen also has reducibility, can be used to remove the micro oxide layer on the metal surface, and is not easy to destroy the sensitive organic layer on the surface. Therefore, it is widely used in microelectronic technology, semiconductor materials and PCB circuit board processing and manufacturing. Because hydrogen is a dangerous gas, it is easy to fuse with oxygen without ionization, which will produce explosion. Therefore, the mixed use of these two gases is not allowed in the plasma cleaning machine. In the vacuum plasma state, hydrogen plasma is bright red, which is similar to argon plasma. It is slightly darker than argon plasma in the same discharge environment.
3. Nitrogen
The plasma ionized by nitrogen reacts with some molecules, so it is also an active gas. However, its particles are heavier than oxygen and hydrogen. In the application of general plasma cleaning machines, this kind of gas is generally defined as a gas between active gas oxygen, hydrogen and rare gas argon. During cleaning and activation, certain bombardment and etching effects shall be achieved, and air oxidation can be avoided on some metal surfaces. Plasma, which is a mixture of nitrogen and other gases, is generally used to deal with some special materials. In the vacuum chamber, under the same discharge, nitrogen plasma will be brighter than argon and hydrogen plasma.
Plasma surface treatment
Oxygen plasma treatment is a commonly used dry etching method. Oxygen (sometimes mixed with argon) is used to treat the surfaces of aluminum, stainless steel, glass, plastics and ceramics.
Plasma activation
Better printing or bonding can be achieved by slightly changing the activated surface. The etching machine can let the plasma erode the printed circuit board to improve its adhesive properties, such as adhesion and finishes.
Plasma surface modification
Plasma surface treatment equipment modification refers to the cleaning of products to improve their printing or bonding ability. The purpose of plasma cleaning is to remove surface organic pollutants. Plasma treatment of your product surface, accept adhesive or printing ink. It is commonly used for plasma surface modification of polytetrafluoroethylene or plastics, which will actually change the surface of the material to leave free radicals and adhere to glue or ink.